Avnu Alliance Drives Interoperability Across Thriving TSN Ecosystem at Hannover

Avnu Member companies and liaison alliance organizations join together to participate in various testbed demonstrations and TSN education opportunities.

Hannover, Germany –– April 23-27, 2018 – Avnu Alliance, the industry consortium driving open, standards-based deterministic networking, is participating in TSN education and demonstrated interoperability at HANNOVER MESSE, where the industry is experiencing a momentum boost for IEEE Time Sensitive Networking (TSN).

Avnu is participating in a number of TSN activities across the conference including:

Liaison Partner Announcements and Demonstrations

IIC TSN Testbed

The Industrial Internet Consortium (IIC) will demonstrate the TSN for Flexible Manufacturing Testbed, the first of its kind that was developed with two major goals – to show TSN’s readiness to accelerate the marketplace; and to show the business value of TSN in converged, deterministic IIoT networks. Momentum is increasing for the testbed, with the IIC hosting its 10th plugfest in an 18-month timeframe at the Bosch Rexroth facility in Frankfurt, Germany and its 9th plugfest, which was held in Austin, TX in February at National Instruments (NI) headquarters following a joint workshop on interoperability with Avnu Alliance. The TSN Testbed recently integrated test tools from Avnu Alliance members, Calnex, Ixia and Spirent into plugfest activities, and demonstrated interoperability of TSN devices from more than 25 companies performing real-time automation and control automation functions over TSN.

Any Avnu Alliance member is welcome to join the IIC TSN Testbed or to participate in a plugfest. Upcoming plugfests will be held in Austin, TX from June 26-29, 2018 and in Stuttgart from July 24-27, 2018.

The TSN Testbed will be demonstrated in the IIC member pavilion (Hall 8, C24) at HANNOVER, and TSN devices will be demonstrated in the booths of testbed participants including Avnu members: Analog Devices, Belden/Hirschmann, Bosch Rexroth, Cisco, General Electric, Hilscher, Intel, NI, Renesas Electronics, Schneider Electric, TTTech and Xilinx.

OPC UA TSN Testbed

The Edge Computing Consortium (ECC) along with members and Avnu Alliance, will host a press conference to announce new developments surrounding the newly created OPC UA TSN testbed on April 23 at 2:00 PM in Room Berlin in the Convention Center on Hannover Exhibition Grounds. The testbed demonstrates six major IIoT scenarios mimicking processes found in smart manufacturing settings and utilizing products across different TSN vendors. Avnu Alliance is a key partner supporting the development of the testbed with the ECC in the shared goal of enabling manufacturers to test their products for interoperability and conduct trials of real-world systems as an early check for problems.

Tom Weingartner, Avnu Alliance member and Analog Devices’ marketing director for Deterministic Ethernet Technology Group, will represent the Alliance at an announcement ceremony toward the end of the press conference beginning at 2:35 PM.

Education Speaking Session

Paul Didier, Avnu Alliance member and IoT solutions architect, Cisco will deliver a talk at the Industrie 4.0 meet the Industrial Internet Forum, in a presentation titled “Time Sensitive Networks – Where does the technology stand and what to expect” on April 23, from 12:00 PM – 12:20 PM (Hall 14, Stand L19). He will provide an update on TSN and how manufacturers, alliances and liaison groups are working together to advance the technology and its implementation in the IIoT.

Paul will present an additional lecture for the Forum on April 26, from 5:00 PM – 5:30 PM on “Modernizing Your Industrial Manufacturing Network” (Hall 8, Stand D17). The presentation will follow the findings coming out of the IIC TSN Testbed and its capabilities, including information on how manufacturing automation and control infrastructure vendors and key decision-makers can leverage TSN for a variety of operational benefits, including increased connectivity between devices and the ability to extract and analyze valuable information through interconnectivity.

“HANNOVER continues to be a key industry event for both Avnu Alliance members and liaison groups that we work with to educate and increase awareness of TSN as a solution for the growing IIoT,” said Todd Walter, Avnu Alliance Industrial Segment Leader and Chief Marketing Manager at NI. “Whether through the developments coming from the TSN testbeds, speaking engagements or product demonstrations, our members and partners are committed to creating an interoperable TSN network that gives all industrial devices a more streamlined path to participating in the TSN ecosystem.

Avnu Alliance members will also demonstrate TSN-ready products across the show floor.  ADI will be showing TSN at the PI stand (Hall 9, Stand D68) and at the ODVA stand (Hall 11 Stand E55). Hirschmann will demonstrate TSN devices across the show floor including as part of the IIC TSN Testbed (IIC member pavilion: Hall 8, C24), at the LNI 4.0 stand (Hall 8, D24), and in the OPC Foundation Pavilion (Hall 9, A11), as well as in other locations throughout the show.

To learn more about Avnu Alliance, visit